Chip Scale Package (CSP) LEDs

Delivering the ultimate in design flexibility

As the trend towards smaller, lighter and thinner luminaires continues to gain momentum, LED manufacturers—including Lumileds—have responded by shrinking the size of their LED packaging. One result of this trend is the growing popularity of Chip Scale Package (CSP) technology. CSP LED technology eliminates the traditional submount to directly attach the LED die to the PCB, allowing for overall system cost reductions. As fully functional LED packages that are equal to or slightly larger than the size of a die, CSP LEDs are increasingly being implemented in lighting designs.

LUXEON FlipChip Royal Blue

Customers have complete design flexibility to access Lumileds industry leading performance at the die level and customize the phosphor and packaging to best suit their lighting applications with the 0.5mm2 LUXEON FlipChip. LUXEON FlipChip is a Chip Scale Package (CSP) LED that can be attached by reflow without additional packaging. Traditional wire bonding limits the packing and power density of LEDs. LUXEON FlipChip LEDs can be packaged closer and can be driven at a higher current density, therefore requiring fewer emitters to achieve a higher lumen output at higher lumen densities.

  • Micro sized CSP: 0.5mm2 package for design flexibilty and packing density
  • No wire bonds allows for direct attach and reflow
  • 5-sided emitter enables wide viewing angles
  • 445–460nm wavelength range for dispense and remote phosphor applications
  • Low thermal resistance of 2.9V for leading system level lm/$